What are the core workstations included in the circuit board dispensing, soldering, and sealing asse
source:
www.cnkaihui.com | Release time:2026年09月28日
The circuit board dispensing, soldering, and sealing assembly line can flexibly adjust the station layout according to the product process sequence (dispensing → soldering → sealing, or soldering → dispensing → sealing). The core stations of the entire production line are as follows:
1. Loading station
The PCB board is manually or mechanically placed on the loading tool, and the tool completes the initial positioning. The conveyor line automatically sends the board to the next process, equipped with material shortage detection and board anti reverse recognition.
2. Preheating station
Using hot air or infrared preheating to increase the temperature of the circuit board in advance and reduce the temperature difference between the boards. It can reduce cold soldering virtual soldering of solder, and also avoid sudden viscosity changes and bubble formation of the adhesive solution when it encounters cold during subsequent dispensing and sealing. Temperature control supports independent adjustment of zones.
3. Glue dispensing station
Equipped with a dispensing valve and visual positioning system, glue is applied to the PCB area according to the preset trajectory, which can be used for component fixation, bottom filling, and moisture-proof sealing. The system controls the amount of glue and the width of the glue line to improve the problems of wire drawing and glue breakage.
4. Soldering station
Select selective wave soldering/laser soldering according to the process, and complete the soldering for PCB solder joints. Equipped with smoke collection device, real-time monitoring of soldering temperature to reduce welding defects such as virtual soldering, soldering continuity, and solder leakage.
5. Pre solidification stage
Perform preliminary curing on the dispensing area to prevent scratching and displacement of the adhesive layer during circulation, ensure that the components are securely fixed before entering the sealing station, and avoid tilting the components due to sealing impact.
6. Sealing station
Two component automatic proportioning glue filling machine+vacuum defoaming module, pour epoxy resin, polyurethane and other sealing materials into the circuit board cavity. Visual assisted positioning, controlling the sealing speed and amount, reducing defects such as bubbles, material shortages, and glue overflow.
7. Curing station
Long section hot air/IR infrared curing tunnel, segmented temperature control, fully crosslinks and solidifies the sealing adhesive, ensuring the hardness and bonding strength of the adhesive layer. The curing temperature and conveying speed are linked to match the curing curve of the adhesive material.
8. Visual inspection workstation
CCD visual inspection, identifying defects such as missing glue, overflow glue, bubbles, poor solder joints, and component offset, distinguishing between good and bad products, and marking the location of the defects.
9. Material cutting/sorting station
Transport the vehicle to the end, manually pick up the board or automatically unload the material; Can be connected to sorting mechanisms to discharge good and defective products in different areas.
10. Vehicle reflux station
The empty loader automatically returns to the feeding end through the lower reflux line, and is recycled for reuse, achieving automated continuous production.