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What scenarios is the multi station integrated machine for dispensing and soldering detection suitab
source：www.cnkaihui.com | Release time：2026年07月23日Loading → visual positioning → dispensing (fixing/reinforcing/sealing/soldering) → curing/preheating → soldering (laser soldering/constant temperature soldering iron soldering) → AOI visual inspection (adhesive path+solder joint) → NG sorting → good product unloading
Suitable for products with the same workpiece that must complete the two processes of dispensing and soldering in sequence, and undergo immediate quality inspection after soldering; Replace three independent devices (glue dispensing machine+soldering machine+testing machine), eliminate process transportation, and reduce secondary positioning errors.
1、 Applicable industries&typical products
1. Consumer electronics/wearable devices (most mainstream scenarios)
Applicable features: Small components, confined spaces, vibration conditions, requiring dual protection of adhesive reinforcement and electrical welding
TWS Bluetooth earphones: battery lead soldering, FPC ribbon soldering, speaker contacts; Glue anti breakage and waterproof reinforcement at the root of the solder joint
Smart watches and bracelets: motors, sensors, FPC soft board welding+edge sealing adhesive
Mobile/tablet camera module (CCM/VCM): coil pad welding, lens base adhesive fixation
Data cable, connector, Type-C female socket: terminal soldering+waterproof glue on the shell
Welding reinforcement of micro speakers and electronic cigarette control board components
2. Automotive electronics (high reliability requirement)
Applicable features: Vehicle grade, anti vibration, moisture-proof and waterproof, widely used with adhesive positioning and then soldering reinforcement process
Various onboard sensors: reverse radar, tire pressure monitoring TPMS, temperature and humidity sensors
Wire harness terminals, small control module PCB, car lighting driver board
ECU small auxiliary board, window/door lock control circuit board
Process: Epoxy reinforcement adhesive at the root of the pin → Soldering → Detection of virtual soldering, insufficient soldering, overflow, and adhesive contamination on the solder pad
3. Industrial control, sensors, and new energy small components
Temperature/pressure/photoelectric sensor internal lead welding, shell sealing and glue dispensing
Relay, small power module, frequency converter drive small board
Energy storage BMS sampling cable, lithium battery protection board nickel sheet/lead welding+reinforcement glue
Welding of servo motor encoder coil pins
4. Optics, Medical Precision Electronics
Medical equipment requires cleanliness, high consistency, and reduced manual contact
Welding and sealing of endoscope module, blood oxygen sensor, and micro medical probe circuit
Optical lens components, laser module PCB welding and adhesive dust prevention
5. Small motors, coils, and transformers industry
Lacquer stripping and soldering of inductors and coil skeleton enameled wires; Glue and seal the welding points to prevent wire breakage
Welding of leads for micro fan motors and vibration motors
2、 At the process level, what kind of products are suitable for purchasing all-in-one machines
1. Priority should be given to those who meet the following conditions
Fixed process sequence: glue dispensing first → soldering later → inspection after soldering (cannot be reversed)
Glue dispensing function: reinforcement, anti vibration, positioning, sealing, anti breakage; It's not just about underfill
The workpiece size is relatively small (generally ≤ 150mm), suitable for carrying multi station fixtures with rotary tables
Medium scale mass production (daily production of thousands to tens of thousands of pcs), pursuing stable rhythm and reducing manual transportation
Multiple turnover is not allowed: Soft board FPC and lightweight plastic parts are prone to deformation and scratches during multiple handling
Need for process traceability: The equipment can synchronize the storage of adhesive road images and solder joint images and dock them with MES
2. Not suitable for the scenario (it is recommended to purchase independent equipment separately)
The interval between the dispensing and soldering processes is very long (requiring a long time for heating and curing)
Oversized PCBs and large board products cannot be completed in one go within the turntable fixture
Large scale SMT full board reflow soldering (reflow soldering cannot be integrated into the integrated machine)
The process sequence is not fixed, and multiple process flows are frequently switched
3、 Application differences corresponding to the structures of two mainstream models
1. Rotary multi station integrated machine (disc rotation)
Suitable for large quantities of small items and single products: headphones, sensors, coils, small connectors; Fast pace and small footprint.
2. Linear conveyor multi station integrated machine
Suitable for medium-sized PCBs and modules, it can be connected to front and rear assembly lines to achieve fully automated production.
4、 Common defects detectable by equipment (supporting process)
Glue dispensing defects: leakage points, broken glue, uneven glue, overflow glue contaminating solder pads, insufficient glue quantity
Solder defects: virtual soldering, solder leakage, insufficient soldering, continuous soldering, solder beads, poor soldering on pins
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