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What are the applications of FPC glue dispensing machines in the electronics industry
source：www.cnkaihui.com | Release time：2026年06月01日1、 Consumer Electronics
1. Mobile phone/foldable screen
Camera module FPC reinforcement+Underfill, anti drop and anti breakage.
FPCUV adhesive reinforcement and bending protection in the hinge area of the folding screen enhance fatigue resistance.
Fingerprint module, earpiece/microphone FPC enclosure+packaging, moisture-proof and short-circuit resistant.
2. TWS earphones/smart wearables
Battery FPC adhesive fixation+insulation sealing.
Charging compartment FPC adhesive reinforcement+waterproofing.
3. Tablet/Notebook
Screen FPCCOF binding sealant, cable reinforcement+shock resistance.
2、 Automotive electronics (high reliability scenario)
In car display/central control: FPC triple anti coating (moisture-proof/salt spray/mold), connector reinforcement and anti vibration.
ADAS/Sensors: Camera, radar FPC bottom filling+thermal conductive adhesive, high temperature resistance, vibration resistance.
BMS/Battery Management: Flexible circuit insulation sealant+flame retardant reinforcement, safety first.
Car lights/interior electronics: LED light beads fixed with FPC+thermal conductivity, suitable for a wide temperature range of -40 ℃~125 ℃.
3、 Semiconductors and Precision Packaging
Underfill of Chip: Capillary filling between QFN/COG/COB chip and FPC to resist impact and prevent solder cracking.
Dam&Fill: Large sized chips/modules are first sealed with a dam to prevent overflow and contamination.
IC/component encapsulation: The dense components on FPC are encapsulated as a whole to prevent moisture, insulation, and mechanical damage.
Micro LED/mini LED: FPC precision adhesive fixation after massive transfer, with adhesive line width ≤ 0.2mm.
4、 Medical Electronics (High Cleanliness+High Insulation)
Wearable monitoring: ECG/blood glucose/blood oxygen devices with FPC sealing insulation and biocompatible adhesive.
Endoscope/Minimally Invasive Equipment: Ultra fine FPC adhesive reinforcement+waterproof, suitable for human environment.
Implantable devices: FPC high reliability packaging and anti-corrosion for pacemakers and other devices.
5、 Industrial Control and New Energy
Industrial sensors/PLCs: FPC three proof coating+fixing, resistant to dust, oil, and vibration.
Photovoltaic inverter/energy storage: Power module FPC thermal conductive adhesive+insulation sealing adhesive, balancing heat dissipation and safety.
Motor/driver: Flexible circuit reinforcement+temperature resistance, suitable for harsh industrial conditions.
6、 FPC Glue Core Process and Adhesive
Reinforcement/strengthening: UV glue, epoxy glue - FPC bending area, connector position to enhance mechanical strength.
Bottom filling: Epoxy Underfill - Fill the gap between the chip and FPC to protect the solder joints.
Sealing/Three Protection: UV glue, silicone, and three protection paint - moisture-proof, insulating, and corrosion-resistant.
Heat conduction: heat conduction gel, heat conduction epoxy - chip/power device heat dissipation.
Conductive/Shielding: Conductive silver paste, conductive adhesive - electromagnetic shielding, grounding connection.
7、 Equipment core capability
Visual positioning: CCD visual automatic recognition, accuracy ± 0.02mm, suitable for FPC micro solder pads.
Precision dispensing: piezoelectric/screw injection valve, droplet size ≤ 0.2mm, high-speed spraying without touching the surface of the board.
Multi axis linkage: 3/4/5 axes, suitable for FPC curved, irregular, and folding structures.
Intelligent adaptation: compatible with adhesives of different viscosities, allowing for one click switching of process parameters.
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